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Dicing Saw (ADT)

Instrument types

The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 6” diameter wafers.

 

Technical Primary Contact:
Aidan Hopkins

Access Procedure: 
For additional information regarding the ADT Dicing Saw, or if you would like to inquire about using the UCSB Nanofabrication Facility, please contact Aidan Hopkins at hopkins@ece.ucsb.edu .