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Nanofabrication Facility

  1. Ashers (Technics PEII)
  2. Atomic Force Microscope (Dimension 3100/Nanoscope IVA)
  3. Chemical-Mechanical Polisher (Logitech)
  4. Contact Aligner (SUSS MA-6)
  5. Critical Point Dryer
  6. Custom Reactive Ion Etcher (RIE 1)
  7. Deep UV Optical Microscope (Olympus)
  8. Dektak VI Profilometer
  9. Develop Wet Benches (3)
  10. Dicing Saw (ADT)
  11. DUV Flood Expose
  12. E-Beam 1 (Sharon)
  13. E-Beam 2 (Custom)
  14. E-Beam 3 (Temescal)
  15. E-Beam 4 (CHA)
  16. E-Beam Lithography System (JEOL JBX-6300FS)
  17. Electron-Beam Evaporation System (E-Beam 3)
  18. Ellipsometer (Rudolph)
  19. Field Emission SEM 1 (FEI Sirion)
  20. Film Stress (Tencor Flexus)
  21. Finetech Flip-Chip Bonder
  22. Fluorescence Microscope (Olympus MX51)
  23. GCA 6300 I-Line Wafer Stepper
  24. GCA AutoStep 200 I-Line Wafer Stepper
  25. Gold Plating Bench
  26. Goniometer
  27. HF/TMAH Processing Bench
  28. High Density ICP PECVD
  29. High Temp Oven (Blue M)
  30. Holographic Lith/PL Setup (Custom)
  31. ICP Etch 1 (Panasonic E626I)
  32. ICP Etch 2 (Panasonic E640)
  33. ICP-Etch (Unaxis VLR)
  34. ICP-Etch (Unaxis VLR)
  35. Interference Lithography System
  36. Ion Beam Deposition (Veeco NEXUS)
  37. Ion Beam Deposition Tool
  38. IR Aligner (SUSS MJB-3 IR)
  39. JEOL 7600F FESEM
  40. Karl-Suss MA-BA-6 Mask / Bond Aligner with Backside Optics
  41. Laser Scanning Confocal M-scope (Olympus LEXT)
  42. Load Locked Metal Evaporator Dual Gun (E-Beam 3)
  43. Mask Aligner - MJB 3 UV400
  44. Mask Aligner - MJB UV400 IR
  45. Molecular Vapor Deposition System
  46. Multi-Wafer Evaporator (E-Beam 4)
  47. Nanonex NX2000 Nanoimprinting System
  48. NRC 3117 Three Source Thermal Evaporator
  49. Optical Film Thickness (Filmetrics)
  50. Optical Film Thickness (Nanometric)
  51. Optical Microscopes
  52. Oven 4 (Fisher)
  53. Ovens 1, 2 & 3 (Labline)
  54. Oxford FlexAL Atomic Layer Deposition System
  55. PECVD 2 (Advanced Vacuum)
  56. PECVD Plasma Therm 790 for Oxides and Nitrides
  57. Plasma Activation (EVG 810)
  58. Plasma Clean (Gasonics 2000)
  59. Plasma Etching Systems
  60. Plating Bench
  61. Probe Station & Curve Tracer
  62. QFI Thermal Infrared Microscope
  63. Rapid Thermal Processor (AET RX6)
  64. Resistivity Mapper (CDE RESMAP)
  65. RIE Fluorine-Based System (RIE 3)
  66. RIE Methane / Hydrogen-Based System (RIE 2)
  67. RIE Programmable, Loadlocked Chlorine Based System (RIE 5)
  68. SEM Sample Coater (Hummer)
  69. Seven-Target DC/RF Magnetron Sputtering System
  70. Si Deep RIE (PlasmaTherm/Bosch Etch)
  71. Si RIE Based Flourine Etcher for Bosch MEMs Processes
  72. Six-Target DC/RF Magnetron Sputtering System
  73. Solvent Cleaning Benches
  74. Spin Coat Benches (3)
  75. Spin Rinse Dryer (SemiTool)
  76. Sputter 1 (Custom)
  77. Sputter 2 (SFI Endeavor)
  78. Sputter 3 (AJA ATC 2000-F)
  79. Sputter 4 (AJA ATC 2200-V)
  80. Sputter 5 (Lesker AXXIS)
  81. Step Profilometer (Dektak IIA)
  82. Stepper 3 (ASML DUV)
  83. Strip Annealer
  84. Surface Analysis (KLA/Tencor Surfscan)
  85. Suss Aligners (SUSS MJB-3)
  86. Thermal Evap 1
  87. Thermal Evap 2 (Solder)
  88. Three-Target DC/RF Sputtering System
  89. Toxic Corrosive Benches
  90. Tube Furnace AlGaAs Oxidation (Lindberg)
  91. Tube Furnace Oxidation/Annealing System (Tystar)
  92. Tube Furnace Wafer Bonding
  93. Tube Furnace Wafer Bonding (Thermco)
  94. UV Flood Exposer
  95. UV Ozone Reactor
  96. Vacuum Oven (YES)
  97. Vacuum Sealer
  98. Vapor HF Etch
  99. Vector Scan Electron Beam Lithography System
  100. Wafer Bonder
  101. Wafer Bonder (SUSS SB6-8E)
  102. Wire Saw (Takatori)
  103. Woolam Spectroscopic Ellipsometer
  104. XeF2 Gas Etcher